Ansys Icepak’s Joule heating analysis solves coupled electrothermal problems with static or transient excitations, while thermal ROM simplifies setup for variable flow rate problems.With EMA3D Cable’s mesh subgrid, engineers can define regions in the model where the mesh cell size can be different from the rest of the model.Ansys SI Xplorer helps PCB designers to define stack-up and optimize via transitions.Ansys HFSS SBR+ enables efficient simulation of 3D dielectrics such as automotive bumper fascia and antenna radomes.Ansys HFSS Phi Plus meshing dramatically increases speed and capacity for 3D IC packaging simulation, including wire bonds.Ansys introduces the Electronics Desktop Student version.Ansys 2021 R2 delivers groundbreaking technologies to address challenges in 3D IC, autonomy, 5G and electrification.
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